iPhone X Data Recovery From Dead Motherboard

REWA 01/10/2019

iPhone X is "the future of the smartphone" according to Apple. There is no doubt that iPhone X brings many new experiences to users once again. However, users still can not avoid data loss in the process of using iPhone X. Of course, you can choose to restore from iTunes/iCloud backup to regain the lost data. Or you buy a data recovery software to regain. The premise of using these methods is your iPhone X can turn on normal. Many users usually ask that my iPhone fell in water and won't turn on, can I get the data from a dead iPhone? So how to recover data when your iPhone won't turn on?


We have many special cases of iPhone won't turn on repair guides and iPhone data recovery, check following:


iPhone 6 Won’t Turn On Repair

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Fix Samsung S7 edge Won’t Turn on

Data Recovery From Dead iPhone 6s

7 Steps for iPhone Data Recovery from Dead Motherboard


As we all know, it is very difficult for repair technicians to extract data from a logic board that cannot be powered up, which requires precise operation with circumspection. And that’s what our iPhone X data recovery case is about today. The iPhone X won’t turn on after water damage. And the problem remains the same after several times of logic board repair. Well, let’s see what REWA can do...


Connect the battery connector on the upper layer with the Power Supplier and press power button to power on. Current reading on the ammeter is abnormal, so the PCB board might have been damaged.


PCB board might have been damaged


To recover data, we need to transplant CPU, Baseband CPU, EEPROM, NAND and baseband EEPROM on the original motherboard onto a new motherboard that can turn on the phone normally. Attach the upper layer to the PCB Holder, Heat with the 858D Hot Air Gun to remove black adhesive around the NAND flash chip. Continue to heat and pry up the NAND flash chip with a specialized knife.


NAND flash chip with a specialized knife


Next, let’s detach CPU, EEPROM, Baseband CPU and Baseband EEPROM from the board with the same steps.


EEPROM from the board with the same steps


Now, we need to reball these detached components


Apply tins to the tip of the Soldering Iron, then clean tins and black adhesive on the NAND flash chip and clean with PCB Cleaner afterwards. Get the BGA Reballing Stencil in position, then Smear Solder Paste evenly on the stencil with BGA Scraper and heat evenly with the 858D Hot Air Gun. So that all solder balls can solidify completely. Once completed, wait for 1 minute. Then separate the NAND flash chip from the stencil.


NAND flash chip from the stencil


Continue to reball the baseband CPU, CPU, EEPROM and baseband EEPROM with the same steps. Please be noted that the WiFi module is bound up with WiFi address stored in the NAND flash chip. So our next move is to unbind WiFi. Connect the PCIE NAND Flash Chip Programmer with computer and have the WiFi unbound. We have talked about iPhone keeps searching for signal and iPhone no service with hardware fix solution.


iPhone no service with hardware fix solutionmotherboard to the new motherboard


Now, we need to solder these detached components of the original motherboard to the new motherboard


Apply some BGA Paste Flux to the bonding pad of the NAND flash chip, get the reball finished NAND flash chip in position, solder with the 858D Hot Air Gun.


Continue to solder CPU, EEPROM, baseband CPU and the baseband EEPROM with the same steps. Once done, clean with PCB Cleaner.


clean with PCB Cleaner.


Next thing we do is to solder the two layers together, we need to test the two layers before soldering. Attach the upper layer and the lower layer to the Holder. Connect the upper layer and the lower layer with the display assembly. Connect the battery connector with DC Power Supply to power on. Current reading on the ammeter is normal this time, the phone can get access to the home screen normally.


phone can get access to the home screen normally


Then, we need to reball the lower layer, once completed, wait for 1 minute. Then apply some BGA Paste Flux to cylinders around the edge. Attach the reball finished lower layer to the heating platform and get the upper layer in position.


upper layer in position


Set operating temperature of the platform, with the upper layer sinking and Paste Flux flowing, continue heating for 1 minute. Then detach the motherboard from the platform after cool down.


detach the motherboard from the platform after cool down


Now we can assemble the phone and test. Get the logic board and display assembly installed, connect the battery and press power button, the phone turns on normally. iPhone X data recovery completed successfully.


iPhone X data recovery completed


Warm tips: get the phone full assembled after confirmation of fault clearance

Our REWA offers the iPhone data recovery service, but the CPU, NAND flash and Baseband CPU mustn’t be damaged. Details please check REWA iPhone Data Recovery Service. Now, let's watch the video for more details of iPhone X data recovery from motherboard.


More related repair guides:

iPhone 7 Plus Half Dim Screen Repair

Fix iPhone X Keeps Restarting

Fix iPhone 6 No Speaker Sound

Fix The iPhone Frozen Screen



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REWA is a world leading electronics repair business solutions provider who was founded in 2008 in HongKong. We are committed to delivering one-stop services covering Sourcing Solution, Technical Support Solution as well as Recycle & Resell Solution.

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