Apr 30, 2021
After months of development, REWA Academy iPhone 11 Pro online repair course is coming soon, expecting to be launched on 14 May.
Before the course, we will walk you through iPhone 11 Pro motherboard chips distribution.
In the first place, let's have a brief introduction about this course. In this course, we will learn the below circuit one by one. They’re totally around 14 circuits we should learn together. And for each circuit, there are two parts included. In the first part we gonna learn the working process of the circuit. And the second part we will learn the troubleshooting process. So there should be around totally 30 lessons in this course. And to learn 30 lessons will not cost so much time. So during the learning process if you have any questions and when it's necessary, you can just stop the video. And go to check the bitmap, schematics or try to make the block diagram drawings by yourself so that you can know the working process and the troubleshooting process better. And this would be very helpful for your future repair business.
For the very first course we will not introduce the details of the circuit. We will have an introduction about the motherboard first.
To know the motherboard is just like to know a friend. So let's try the best to know the motherboard as well as possible. As we can see, for the iPhone 11 pro motherboard, it's just more or less like the iPhone X. It's with two layers structure. And for the two layers, the upper layer we call it logic board. Lower layer we call it signal board.
Let's come to the first layer of the logic board first. There are so many connectors on the logic board. As we know, there are three rear cameras for the iPhone 11 Pro. So these three connectors are related with the rear cameras. The longest one is the dock flex cable connector. Because on the dock flex cable, there are so many functions integrated for example the charging, USB the main microphone and also some antenna the vibrator, the loudspeaker. So this connector is the longest. The Face ID module is mainly related with Infrared camera, dot projector and flood illuminator. Rosaline controls not only the flood illuminator but also some sensors like the ambient light sensor and proximity sensor. The PMU is just like the heart of the mobile power supply system. The Face ID power IC, it's mainly responsible for power supply of the Face ID modules. The tiny chip is Boost IC. It's used for providing the PP_VDD_BOOST which is an essential power supply for many components. So if this one gets damaged, the phone cannot be boot up. UWB is short for Ultra Wideband power supply. Audio CODEC IC is mainly responsible for the control of the audio-related circuit like the microphone circuit, speaker circuit or vibrator circuit. USB IC is very important for the charging data transforming or accessory identifications, etc. EEPROM's very important for the data recovery.
OK, so let's continue. (On the signal board) The chips are many related with the Wi-Fi, the RF circuit, the Baseband, the NFC
Sometimes we can know the function of the chip from the name, right? For example, CPLR means coupler. Strobe flash IC controls the power supply for the LEDs. Baseband PMU is responsible to supply powers for the Baseband CPU. ET here is short for the envelope tracker. It's also an important chip for the RF circuit which supplies powers for like the power amplifier ICs the DSM chips, etc. MIMO here means multiple input and multiple output, it's also related with RF circuit. And on another side of signal board. There are many test points
Watch the video to see iPhone 11 Pro chips distribution in detail.
Pro-order iPhone 11Pro motherboard repair course now to get a 20% discount. (Limited offer: 28, Apr - 13, May)
Apr 23, 2021
REWA is a world leading electronics repair business solutions provider who was founded in 2008 in HongKong. We are committed to delivering one-stop services covering Sourcing Solution, Technical Support Solution as well as Recycle & Resell Solution.